Low Residue Solder Paste "EVASOL 6001 Series"
Reduce residue volume, compatible with ICT testing, good wettability and high assembly quality.
Compatible with ICT testing The 'EVASOL 6001 series' uses a special base material in the flux to reduce residue levels. It demonstrates a high vertical rate in ICT testing. Good wettability It uses a special surfactant and shows wettability equivalent to products with normal residue levels. High printing stability It prevents reactions between the flux and powder, preventing viscosity changes during continuous printing. Stable mounting is possible. 【Features】 ■ High vertical rate in continuity testing ■ High stability in continuous printing ■ Good wettability *For more details, please refer to the PDF materials or feel free to contact us.
- Company：石川金属
- Price：Other
